FIRST-CLASS QUALITY: The heat insulation tape is made of high-temperature resistant polyimide polymer film with excellent physical balance and is brown (amber). The heat-resistant adhesive tape has good adhesion, good conformability, high temperature resistance, solvent resistance, no tin penetration, no adhesive residue. PERFORMANCE: The size of * 30mm * 0.06mm makes the heat insulation tape suitable for BGA chip soldering. The short-term temperature resistance is 300 and the long-term temperature resistance is 250 ℃. The high extensibility of more than 35% and the high peel strength up to 5N / 25mm allow this heat resistant tape to have a long service life NO RESIDUE: High insulation, high temperature resistance, low temperature resistance, acid and alkali resistance, low electrolysis, good mechanical properties, abrasion resistance and tear resistance. Special adhesive treatment, strong adhesion, leaves no residue on the surface after tearing off. The yellow label makes it easier